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Data Sheet, Rev. 0.5, Dez. 2003
HYS64D128021[G/H]BDL-5-B HYS64D128021[G/H]BDL-6-B
200-Pin Small Outline Dual-In-Line Memory Modules SO-DIMM DDR SDRAM Green Product Lead Containing Product
Memory Products
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Edition 2003-12 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen, Germany (c) Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet, Rev. 0.5, Dez. 2003
HYS64D128021[G/H]BDL-5-B HYS64D128021[G/H]BDL-6-B
200-Pin Small Outline Dual-In-Line Memory Modules SO-DIMM DDR SDRAM
Memory Products
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HYS64D128021[G/H]BDL-5-B, HYS64D128021[G/H]BDL-6-B, Revision History: Previous Version: Page Subjects (major changes since last revision) Rev. 0.5 2003-12
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HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Table of Contents 1 1.1 1.2 2 3 3.1 3.2 3.3 4 5 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 14 16
SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Data Sheet
5
Rev. 0.5, 2003-12
200-Pin Small Outline Dual-In-Line Memory Modules SO-DIMM
HYS64D128021[G/H]BDL-5-B HYS64D128021[G/H]BDL-6-B
1
1.1
* * * * * * * * * * *
Overview
Features
Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules Two ranks 128M x 64 organization Built with stacked 512 Mbit DDR SDRAMs dies in P-TFBGA-68 package JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM) Single +2.5 V ( 0.2 V) power supply and +2.6 V ( 0.2 V) power supply for DDR400 Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave) Auto Refresh (CBR) and Self Refresh All inputs and outputs SSTL_2 compatible Serial Presence Detect with E2PROM Jedec standard form factor: 67.60 mm x 31.75 mm x 3.80 mm Gold plated contacts Performance -5 DDR400B PC3200-3033 -6 DDR333B PC2700-2533 166 166 133 Unit -- -- MHz MHz MHz Component Module @CL3 @CL2.5 @CL2
Table 1
Part Number Speed Code Speed Grade max. Clock Frequency
fCK3 fCK2.5 fCK2
200 166 133
1.2
Description
The HYS64D128021[G/H]BDL-5-B and HYS64D128021[G/H]BDL-6-B are industry standard 200-Pin Small Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 128M x 64. The memory array is designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are mounted on the PC board. The DIMMs feature serial presence detect based on a serial E2PROM device using the 2-pin I2C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are available to the customer
Data Sheet
6
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Overview Table 2 Type PC3200 (CL=3) HYS64D128021GBDL-5-B PC2700 (CL=2.5) HYS64D128021GBDL-6-B PC2700S-2533-0-Z two ranks 1 GB SO-DIMM 512 MBit (x8) PC3200S-3033-1-Z two ranks 1 GB SO-DIMM 512 MBit (x8) Ordering Information Compliance Code Description SDRAM Technology
PC3200 (CL=3) HYS64D128021HBDL-5-B PC2700 (CL=2.5) HYS64D128021HBDL-6-B Note: 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. 2. The Compliance Code is printed on the module labels describing the speed sort (for example "PC2700"), the latencies and SPD code definition (for example "2033-0" means CAS latency of 2.0 clocks, RCD1) latency of 3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card used for this module. PC2700S-2533-0-Z two ranks 1 GB SO-DIMM 512 MBit (x8) PC3200S-3033-1-Z two ranks 1 GB SO-DIMM 512 MBit (x8)
1) RCD: Row-Column-Delay
Data Sheet
7
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Pin Configuration
2
Table 3 Symbol A0 - A12 BA0, BA1 DQ0 - DQ63
Pin Configuration
Pin Definitions and Functions Type1) I I I/O I I I/O I I I I PWR GND PWR PWR AI PWR I I/O I NC NU Function Address Inputs Bank Address Data Input/Output Command Input Clock Enable SDRAM Data Strobe SDRAM Clock (true signal) SDRAM Clock (complementary signal) Data Mask Chip Select Power (+ 2.5 V) Ground I/O Driver power supply VDD Indentification flag I/O reference supply Serial EEPROM power supply Serial bus clock Serial bus data line slave address select Not Connected Not Usable, reserved for future use
RAS, CAS, WE CKE0 - CKE1 DQS0 - DQS7 CK0 - CK1, CK0 - CK1 DM0 - DM8 S0, S1 VDD VSS VDDQ VDDID VREF VDDSPD SCL SDA SA0 - SA2 NC NU
2)
1) I: Input; O: Output; I/O: bidirectional In-/Output; AI: Analog Input; PWR: Power Supply; GND: Signal Ground; NC: Not Connected; NU: Not Usable 2) CKE1 and S1 are used on two bank modules only
Data Sheet
8
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Pin Configuration Table 4 Front side Pin # 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Symbol Pin Configuration Back side Pin # 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Key 41 43 45 47 49 51 53 55 57 59 61 63 DQ16 DQ17 42 44 46 48 50 52 54 56 58 60 62 64 DQ20 DQ21 Symbol Front side Pin # 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 121 123 125 127 129 131 Symbol DQ26 DQ27 Back side Pin # 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 Symbol DQ30 DQ31 Front side Pin # 133 135 137 139 141 143 145 147 149 151 153 155 157 159 161 163 165 167 169 171 173 175 177 179 181 183 185 187 189 191 193 195 197 199 Symbol DQS4 DQ34 Back side Pin # 134 136 138 140 142 144 146 148 150 152 154 156 158 160 162 164 166 168 170 172 174 176 178 180 182 184 186 188 190 192 194 196 198 200 Symbol DM4 DQ38
VREF VSS
DQ0 DQ1
VREF VSS
DQ4 DQ5
VDD
(CB0) (CB1)
VDD
(CB4) (CB5)
VSS
DQ35 DQ40
VSS
DQ39 DQ44
VDD
DQS0 DQ2
VDD
DM0 DQ6
VSS
(DQS8) (CB2)
VSS
(DM8) (CB6)
VDD
DQ41 DQS5
VDD
DQ45 DM5
VSS
DQ3 DQ8
VSS
DQ7 DQ12
VDD
(CB3) DU
VDD
(CB7) DU
VSS
DQ42 DQ43
VSS
DQ46 DQ47
VDD
DQ9 DQS1
VDD
DQ13 DM1
VSS
(CK2) (CK2)
VSS
DQ10 DQ11
VSS
DQ14 DQ15
VDD
CKE1 DU A12 A9
VSS VSS VDD VDD
CKE0 DU A11 A8
VDD VDD VSS VSS
DQ48 DQ49
VDD
CK1 CK1
VSS
DQ52 DQ53
VDD
CK0 CK0
VSS
VDD VDD VSS VSS
VDD
DQS6 DQ50
VDD
DM6 DQ54
VSS
A7 A5 A3 A1
VSS
A6 A4 A2 A0
VSS
DQ51 DQ56
VSS
DQ55 DQ60
VDD
DQ57 DQS7
VDD
DQ61 DM7
VDD
DQS2 DQ18
VDD
DM2 DQ22
VDD
A10/AP BA0 WE S0 DU
VDD
BA1 RAS CAS S1 DU
VSS
DQ58 DQ59
VSS
DQ62 DQ63
VSS
DQ19 DQ24
VSS
DQ23 DQ28
VDD
SDA SCL
VDD
SA0 SA1 SA2 DU
VDD
DQ25 DQS3
VDD
DQ29 DM3
VSS
DQ32 DQ33
VSS
DQ36 DQ37
VSS
VSS
VDD
VDD
VDDSPD VDDID
Data Sheet
9
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Pin Configuration
Table 5 Density 1GB
Address Format Organization 128M x 64 Memory Ranks 2 SDRAMs 64M x 8 # of SDRAMs 16 # of row/bank/ columns bits 13/2/11 Refresh 8K Period 64 ms Interval 7.8 s
pin 40 pin 42
back side
Figure 1
Pin Configuration
Data Sheet
10
pin 200
pin 2
pin 199
pin 39 pin 41
front side
pin 1
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Pin Configuration
S1 S0 DQS0 DM0/DQS9
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
DQS4 DM4/DQS13
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
D0
D8
D4
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
S
DQS
D12
DQS1 DM1/DQS10
DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
DQS5 DM5/DQS14
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
D1
D9
D5
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
S
DQS
D13
DQS2 DM2/DQS11
DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
DQS6 DM6/DQS15
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
D2
D10
D6
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
S
DQS
D14
DQS3 DM3/DQS12
DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
DQS7 DM7/DQS16
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S DQS
D3
D11
D7
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
S
DQS
D15
VDD SPD VDD/VDDQ VREF VSS VDDID
SPD D0 - D15 D0 - D15 D0 - D15 Strap: see Note 4 SCL WP A0 SA0 SDA A1 SA1 A2 SA2 Serial PD
BA0 - BA1 A0 - An CKE1 RAS CAS CKE0 WE
BA0-BA1: SDRAMs D0 - D15 A0-An: SDRAMs D0 - D15 CKE: SDRAMs D8 - D15 RAS: SDRAMs D0 - D15 CAS: SDRAMs D0 - D15 CKE: SDRAMs D0 - D7 WE: SDRAMs D0 - D15
* Clock Wiring Clock SDRAMs Input *CK0/CK0 *CK1/CK1 *CK2/CK2 4 SDRAMs 6 SDRAMs 6 SDRAMs
Notes: 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. DQ/DQS/DM/CKE/S relationships must be maintained as shown. 3. DQ, DQS, DM/DQS resistors: 22 ohms 5%. 4. VDDID strap connections (for memory device VDD, V DDQ): STRAP OUT (OPEN): VDD = VDDQ STRAP IN (VSS): V DD VDDQ 5. BAx, Ax, RAS, CAS, WE resistors: 3 ohms +5%
* Wire per Clock Loading Table/Wiring Diagrams
Figure 2
Block Diagram - 2 Ranks 128M x 64 DDR SDRAM SO-DIMM HYS64D128021[H/G]BDL-[5/6]-B
Data Sheet
11
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics
3
3.1
Table 6 Parameter
Electrical Characteristics
Operating Conditions
Absolute Maximum Ratings Symbol min. Values typ. - - - - - - 1 50 max. Unit Note/ Test Condition V V V V C C W mA - - - - - - - -
Voltage on I/O pins relative to VSS Voltage on inputs relative to VSS Voltage on VDD supply relative to VSS Voltage on VDDQ supply relative to VSS Operating temperature (ambient) Storage temperature (plastic) Power dissipation (per SDRAM component) Short circuit output current
VIN, VOUT -0.5 VIN VDD VDDQ TA TSTG PD IOUT
-1 -1 -1 0 -55 - -
VDDQ +
0.5 +3.6 +3.6 +3.6 +70 +150 - -
Attention: Permanent damage to the device may occur if "Absolute Maximum Ratings" are exceeded. This is a stress rating only, and functional operation should be restricted to recommended operation conditions. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability and exceeding only one of the values may cause irreversible damage to the integrated circuit. Table 7 Parameter Device Supply Voltage Device Supply Voltage Output Supply Voltage Electrical Characteristics and DC Operating Conditions Symbol Min. Values Typ. 2.5 2.6 2.5 2.6 2.5 Max. 2.7 2.7 2.7 2.7 3.6 0 0.5 x 0.51 x V V V V V V V 2.3 2.5 2.3 2.5 2.3 0 0.49 x Unit Note/Test Condition 1)
VDD
VDD VDDQ Output Supply Voltage VDDQ EEPROM supply voltage VDDSPD Supply Voltage, I/O Supply VSS, Voltage VSSQ Input Reference Voltage VREF
I/O Termination Voltage (System)
fCK 166 MHz fCK > 166 MHz 2) fCK 166 MHz 3) fCK > 166 MHz 2)3)
-- --
4)
VTT
VDDQ VDDQ VREF - 0.04 VREF + 0.15
-0.3 -0.3 0.36 0.71
VDDQ VREF + 0.04 V VDDQ + 0.3 V VREF - 0.15 V VDDQ + 0.3 V VDDQ + 0.6 V
1.4 --
5)
Input High (Logic1) Voltage VIH(DC) Input Low (Logic0) Voltage VIL(DC) Input Voltage Level, CK and CK Inputs Input Differential Voltage, CK and CK Inputs VI-Matching Pull-up Current to Pull-down Current
8) 8) 8)
VIN(DC) VID(DC)
VIRatio
8)6)
7)
Data Sheet
12
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics Table 7 Parameter Input Leakage Current Electrical Characteristics and DC Operating Conditions (cont'd) Symbol Min. Values Typ. Max. 2 A Any input 0 V VIN VDD; All other pins not under test = 0 V 8)9) DQs are disabled; 0 V VOUT VDDQ -2 Unit Note/Test Condition 1)
II
Output Leakage Current Output High Current, Normal Strength Driver Output Low Current, Normal Strength Driver
1) 0 C TA 70 C
IOZ IOH IOL
-5 -- 16.2
5 -16.2 --
A mA mA
VOUT = 1.95 V VOUT = 0.35 V
2) DDR400 conditions apply for all clock frequencies above 166 MHz 3) Under all conditions, VDDQ must be less than or equal to VDD. 4) Peak to peak AC noise on VREF may not exceed 2% VREF (DC). VREF is also expected to track noise variations in VDDQ. 5) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. 6) VID is the magnitude of the difference between the input level on CK and the input level on CK. 7) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. 8) Inputs are not recognized as valid until VREF stabilizes. 9) Values are shown per component
Data Sheet
13
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics
3.2
Table 8 Parameter
Current Specification and Conditions
IDD Conditions
Symbol
Operating Current 0 one bank; active/ precharge; DQ, DM, and DQS inputs changing once per clock cycle; address and control inputs changing once every two clock cycles. Operating Current 1 one bank; active/read/precharge; Burst Length = 4; see component data sheet. Precharge Power-Down Standby Current all banks idle; power-down mode; CKE VIL,MAX Precharge Floating Standby Current CS VIH,,MIN, all banks idle; CKE VIH,MIN; address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS and DM. Precharge Quiet Standby Current CS VIHMIN, all banks idle; CKE VIH,MIN; VIN = VREF for DQ, DQS and DM; address and other control inputs stable at VIH,MIN or VIL,MAX. Active Power-Down Standby Current one bank active; power-down mode; CKE VILMAX; VIN = VREF for DQ, DQS and DM. Active Standby Current one bank active; CS VIH,MIN; CKE VIH,MIN; tRC = tRAS,MAX; DQ, DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle. Operating Current Read one bank active; Burst Length = 2; reads; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B; IOUT = 0 mA Operating Current Write one bank active; Burst Length = 2; writes; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR266(A), CL = 3 for DDR333 and DDR400B Auto-Refresh Current tRC = tRFCMIN, burst refresh Self-Refresh Current CKE 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet.
IDD0
IDD1 IDD2P IDD2F
IDD2Q
IDD3P IDD3N
IDD4R
IDD4W
IDD5 IDD6 IDD7
Data Sheet
14
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics
Table 9
IDD Specification for HYS64D128021[H/G]BDL-[5/6]-B
HYS64D128021GBDL-5-B HYS64D128021HBDL-5-B HYS64D128021GBDL-6-B HYS64D128021HBDL-6-B Unit Note 1)2)
Part Number & Organization
1 GB x64 2 Ranks -5 typ. 1136 1256 48 480 304 192 672 1296 1336 2296 tbd 3096 max. 1360 1520 80 576 416 256 800 1560 1600 2760 tbd 3680
1 GB x64 2 Ranks -6 typ. 1016 1136 48 400 272 176 592 1136 1176 2056 tbd 2776 max. 1232 1352 64 480 384 240 704 1352 1392 2472 tbd 3272 mA mA mA mA mA mA mA mA mA mA mA mA
3) 3)4) 5) 5) 5) 5) 5) 3)4) 3) 3) 5) 3)4)
Symbol
IDD0 IDD1 IDD2P IDD2F IDD2Q IDD3P IDD3N IDD4R IDD4W IDD5 IDD6 IDD7
1) Module IDD values are calculated on the basis of component IDD and can be measured differently according to DQ loading capacity. 2) Test condition for maximum values: VDD = 2.7 V, TA = 10 C 3) The module IDDx values are calculated from the IDDx values of the component data sheet as follows: m x IDDx[component] + n x IDD3N[component] with m and n number of components of rank 1 and 2; n=0 for 1 rank modules 4) DQ I/O (IDDQ) currents are not included in the calculations 5) The module IDDx values are calculated from the corrponent IDDx data sheet values as: (m + n) x IDDx[component]
Data Sheet
15
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics
3.3
Table 10 Parameter
AC Characteristics
AC Timing - Absolute Specifications -6/-5 Symbol Min. -6 DDR333B Max. +0.7 +0.6 0.55 0.55 -- 12 12 -- -- -- -- +0.7 +0.7 1.25 +0.40 +0.50 -- -- -- -- -- -- 0.60 -- Min. -0.6 -0.5 0.45 0.45 5 6 7.5 0.4 0.4 2.2 1.75 -- -0.6 0.75 -- -- -5 DDR400B Max. +0.6 +0.5 0.55 0.55 12 12 12 -- -- -- -- +0.6 +0.6 1.25 +0.40 +0.50 -- -- -- -- -- -- 0.60 -- ns ns
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)
Unit
Note/ Test Condition 1)
DQ output access time from CK/CK DQS output access time from CK/CK CK high-level width CK low-level width Clock Half Period Clock cycle time
tAC tDQSCK tCH tCL tHP tCK
-0.7 -0.6 0.45 0.45 -- 6 7.5
tCK tCK
ns ns ns ns ns ns ns ns ns ns
min. (tCL, tCH)
min. (tCL, tCH)
CL = 3.0
2)3)4)5)
CL = 2.5
2)3)4)5)
CL = 2.0
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)6)
DQ and DM input hold time DQ and DM input setup time Control and Addr. input pulse width (each input) DQ and DM input pulse width (each input) Data-out high-impedance time from CK/CK
tDH tDS tIPW tDIPW tHZ
0.45 0.45 2.2 1.75 -- -0.7 0.75 -- --
2)3)4)5)6)
2)3)4)5)7)
Data-out low-impedance time from CK/ tLZ CK Write command to 1st DQS latching transition DQS-DQ skew (DQS and associated DQ signals) Data hold skew factor DQ/DQS output hold time
2)3)4)5)7)
tDQSS tDQSQ tQHS tQH
tCK
ns ns ns
2)3)4)5)
TFBGA
2)3)4)5)
TFBGA
2)3)4)5) 2)3)4)5)
tHP - tQHS
0.35 0.2 0.2 2 0 0.40 0.25
tHP - tQHS
0.35 0.2 0.2 2 0 0.40 0.25
DQS input low (high) pulse width (write tDQSL,H cycle) DQS falling edge to CK setup time (write cycle) DQS falling edge hold time from CK (write cycle) Write preamble setup time Write postamble Write preamble
tCK tCK tCK tCK
ns
2)3)4)5)
tDSS tDSH
2)3)4)5)
2)3)4)5)
Mode register set command cycle time tMRD
2)3)4)5) 2)3)4)5)8) 2)3)4)5)9) 2)3)4)5)
tWPRES tWPST tWPRE
tCK tCK
Data Sheet
16
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics Table 10 Parameter AC Timing - Absolute Specifications -6/-5 (cont'd) Symbol Min. Address and control input setup time -6 DDR333B Max. -- -- Min. 0.6 0.7 -5 DDR400B Max. -- -- ns ns fast slew rate
3)4)5)6)10)
Unit
Note/ Test Condition 1)
tIS
0.75 0.8
slow slew rate
3)4)5)6)10)
Address and control input hold time
tIH
0.75 0.8
-- --
0.6 0.7
-- --
ns ns
fast slew rate
3)4)5)6)10)
slow slew rate
3)4)5)6)10) 2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)
tRPRE Read postamble tRPST Active to Precharge command tRAS Active to Active/Auto-refresh command tRC
Read preamble period Auto-refresh to Active/Auto-refresh command period Active to Read or Write delay Precharge command period Active to Autoprecharge delay Active bank A to Active bank B command Write recovery time Auto precharge write recovery + precharge time Internal write to read command delay
0.9 0.40 42 60 72 18 18 18 12 15
1.1 0.60 70E+3 -- -- -- -- -- -- --
0.9 0.40 40 55 65 15 15 15 10 15
1.1 0.60 70E+3 -- -- -- -- -- -- --
tCK tCK
ns ns ns ns ns ns ns ns
tRFC tRCD tRP tRAP tRRD tWR tDAL
2)3)4)5)
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)
2)3)4)5) 2)3)4)5)11)
tCK
1 75 200 -- -- -- -- 7.8 1 75 200 -- -- -- -- 7.8
tWTR Exit self-refresh to non-read command tXSNR Exit self-refresh to read command tXSRD Average Periodic Refresh Interval tREFI
tCK
ns
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)12)
tCK
s
1) 0 C TA 70 C; VDDQ = 2.5 V 0.2 V, VDD = +2.5 V 0.2 V (DDR333); VDDQ = 2.6 V 0.1 V, VDD = +2.6 V 0.1 V (DDR400) 2) Input slew rate 1 V/ns for DDR400, DDR333 3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals other than CK/CK, is VREF. CK/CK slew rate are 1.0 V/ns. 4) Inputs are not recognized as valid until VREF stabilizes. 5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT. 6) These parameters guarantee device timing, but they are not necessarily tested on each device. 7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ). 8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge. A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
Data Sheet
17
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Electrical Characteristics
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. 10) Fast slew rate 1.0 V/ns , slow slew rate 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ ns, measured between VOH(ac) and VOL(ac). 11) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock cycle time. 12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
Data Sheet
18
Rev. 0.5, 2003-12
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
SPD Contents
4
Table 11
SPD Contents
SPD Codes for HYS64D128021[H/G]BDL-[5/6]-B HYS64D128021GBDL-5-B HYS64D128021GBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX 80 08 07 0D 0B 02 40 00 04 60 70 00 82 08 00 01 0E 04 0C 01 02 20 Rev. 0.5, 2003-12 HYS64D128021HBDL-5-B HYS64D128021HBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX 80 08 07 0D 0B 02 40 00 04 60 70 00 82 08 00 01 0E 04 0C 01 02 20
Product Type & Organization
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX 80 08 07 0D 0B 02 40 00 04 50
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX 80 08 07 0D 0B 02 40 00 04 50 50 00 82 08 00 01 0E 04 1C 01 02 20
Label Code Jedec SPD Revision Byte# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Description Programmed SPD Bytes in E2PROM Total number of Bytes in E2PROM Memory Type (DDR = 07h) Number of Row Addresses Number of Column Addresses Number of DIMM Ranks Data Width (LSB) Data Width (MSB) Interface Voltage Levels tCK @ CLmax (Byte 18) [ns]
tAC SDRAM @ CLmax (Byte 18) 50 [ns] Error Correction Support Refresh Rate Primary SDRAM Width Error Checking SDRAM Width tCCD [cycles] Burst Length Supported Number of Banks on SDRAM Device CAS Latency CS Latency Write Latency DIMM Attributes 00 82 08 00 01 0E 04 1C 01 02 20
Data Sheet
19
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
SPD Contents
Table 11 SPD Codes for HYS64D128021[H/G]BDL-[5/6]-B HYS64D128021GBDL-5-B HYS64D128021GBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX C1 75 70 00 00 48 30 48 2A 80 75 75 45 45 00 3C 48 30 28 50 00 00 00 00 39 C1 00 Rev. 0.5, 2003-12 HYS64D128021HBDL-5-B HYS64D128021HBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX C1 75 70 00 00 48 30 48 2A 80 75 75 45 45 00 3C 48 30 28 50 00 00 00 00 39 C1 00
Product Type & Organization
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX C1 50 75 50 3C 28 3C 28 80 60 60 40 40 00 37 41 28 28 50 00 01 00 10 50 C1
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX C1 60 50 75 50 3C 28 3C 28 80 60 60 40 40 00 37 41 28 28 50 00 01 00 10 50 C1 00 20
Label Code Jedec SPD Revision Byte# 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 - 40 41 42 43 44 45 46 47 48 - 61 62 63 64 65 - 71 Description Component Attributes tAC SDRAM @ CLmax -0.5 [ns] tCK @ CLmax -1 (Byte 18) [ns] tAC SDRAM @ CLmax -1 [ns] tRPmin [ns] tRRDmin [ns] tRCDmin [ns] tRASmin [ns] Module Density per Rank tAS, tCS [ns] tAH, TCH [ns] tDS [ns] tDH [ns] not used tRCmin [ns] tRFCmin [ns] tCKmax [ns] tDQSQmax [ns] tQHSmax [ns] not used DIMM PCB Height not used SPD Revision Checksum of Byte 0-62 JEDEC ID Code of Infineon (1)
tCK @ CLmax -0.5 (Byte 18) [ns] 60
JEDEC ID Code of Infineon (2 - 8) 00
Data Sheet
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
SPD Contents
Table 11 SPD Codes for HYS64D128021[H/G]BDL-[5/6]-B HYS64D128021GBDL-5-B HYS64D128021GBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX xx 36 34 44 31 32 38 30 32 31 47 42 44 4C 36 42 20 20 20 xx xx xx xx xx 00 Rev. 0.5, 2003-12 HYS64D128021HBDL-5-B HYS64D128021HBDL-6-B 1 GByte x64 2 Ranks PC2700S- 2533-0 Rev 0.0 HEX xx 36 34 44 31 32 38 30 32 31 48 42 44 4C 36 42 20 20 20 xx xx xx xx xx 00
Product Type & Organization
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX xx 36 34 44 31 32 38 30 32 31 48 42 44 4C 35 42 20 20 20 xx xx
1 GByte x64 2 Ranks PC3200S- 3033-1 Rev 1.0 HEX xx 36 34 44 31 32 38 30 32 31 47 42 44 4C 35 42 20 20 20 xx xx xx xx xx 00
Label Code Jedec SPD Revision Byte# 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 - 98 Description Module Manufacturer Location Part Number, Char 1 Part Number, Char 2 Part Number, Char 3 Part Number, Char 4 Part Number, Char 5 Part Number, Char 6 Part Number, Char 7 Part Number, Char 8 Part Number, Char 9 Part Number, Char 10 Part Number, Char 11 Part Number, Char 12 Part Number, Char 13 Part Number, Char 14 Part Number, Char 15 Part Number, Char 16 Part Number, Char 17 Part Number, Char 18 Module Revision Code Test Program Revision Code
Module Manufacturing Date Year xx Module Manufacturing Date Week xx Module Serial Number (1 - 4) xx 00
99 - 127 not used
Data Sheet
21
HYS64D128021[H/G]BDL-[5/6]-B Small Outline DDR SDRAM Modules
Package Outlines
5
Package Outlines
67.6 63.6 0.1 3.8 MAX.
1.8 0.05
(2.15)
4 0.1
1
18.45 0.1 1.8 0.1 (2.4)
(2.45)
100
31.75
10.1
0.15
11.4 0.1
47.4 0.1
(2.7) (2.45)
4 0.1
1.5 0.1 10.1 101
(2.15) 200
6 0.1 20 0.1
2 MIN. Detail of contacts
0.25 -0.18
0.45 0.03 0.6 0.1
Burnished, no burr allowed
L-DIM-200-022
Figure 3
Package Outlines - DDR-SDRAM SO-DIMM HYS64D128021[H/G]BDL-[5/6]-B
Data Sheet
2.55
22
Rev. 0.5, 2003-12
www.infineon.com
Published by Infineon Technologies AG

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